WebA fabrication procedure using dry plasma process technology has been developed for HgCdTe photoconductive detectors. Dry plasma, in the form of CH 4 /H 2 reactive ion etching, was used in a multi-functional process capacity after the mesa delineation of individual detector elements and prior to metal contact deposition to (i) etch the … Webplasma processing to perform passivation etching of HgCdTe. Plasma pro-cessing promises the ability to create small vias, 2 lm or less with excellent uniformity across a …
Recent infrared detector technologies, applications, trends and ...
WebApr 14, 2024 · The Bosch process, with SF 6 as the etching gas and C 4 F 8 as the passivation gas used alternately in the reactor chamber, cycles the etching and passivation steps for deep silicon etching [34,35,36,37]. During the passivation cycle, C 4 F 8 is ionized by ICP power and deposited on all exposed surfaces forming a fluorocarbon polymer to … WebThe main issue of HgCdTe passivation consists in sur-face structure instability due to weakness of Hg–Te bonds ... and adventitious carbon without etching HgCdTe [22]. The ... cases of glow discharge and remote RF plasma resulting HgCdTe native oxide thickness, measured by means of x-ray photoelectron spectroscopy [23], was about 2 nm ... guinea monetary value
Sidewall passivation assisted by a silicon coverplate during …
WebMay 14, 2007 · Inductively coupled plasma (ICP) chemistry based on a mixture of CH 4, Ar, and H 2 was investigated for the purpose of delineating HgCdTe mesa structures and vias typically used in the fabrication of second and third generation infrared photo detector arrays. We report on ICP etching uniformity results and correlate them with plasma … WebMay 1, 2024 · Plasma etching stands as the main etching technique of HgCdTe nowadays for its superior uniformity over large samples and run to run stability. However, in … WebMethods and apparatus for laterally etching unwanted material from the sidewalls of a recessed feature are described herein. In various embodiments, the method involves etching a portion of the sidewalls, depositing a protective film over a portion of the sidewalls, and cycling the etching and deposition operations until the unwanted material is removed … guineanlahti